OEM 60 inches of SnAgCu, NC600, 2.2% Flux
Great Deal. This is a "no labels" coiled piece of lead-free solder 0.032/in 0.81/mm diameter, 60 inches long, no-clean flux core Qualitek NC600 solder.
Qualitek Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.
Qualitek has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no spattering. NC600 conforms to J-STD-004, REL0.
- Excellent wettability
- Hard non-conductive residues
NC600 is a no clean formulation. Therefore the residues do not need to be removed for typical applications.
Melting Point, degrees C 217-221
Hardness, Brinell 15HB
Coefficient of Thermal Expansion Pure Sn=23.5
Tensile Strength, psi 4312
Density, g/cc 7.39
Electrical Resistivity, (uohm-cm) 13.0
Electrical Conductivity, %IACS 16.6
Yield Strength, psi 3724
Total Elongation, % 27
Joint Shear Strength, at 0.1mm/min 20 C 27
Joint Shear Strength, at 0.1mm/min 100 C 17
Creep Strength, N/mm2 at 0.1mm/min 20 C 13.0
Creep Strength, N/mm2 at 0.1mm/min 100 C 5
Thermal Conductivity, W/m.K 58.7