LeadFree Solder NoClean Flux Core

OEM 60 inches of SnAgCu, NC600, 2.2% Flux

Great Deal. This is a "no labels" coiled piece of lead-free solder 0.032/in 0.81/mm diameter, 60 inches long, no-clean flux core Qualitek NC600 solder.

Physical Properties

Solder Composition

Qualitek Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.

Flux Core

Qualitek has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no spattering. NC600 conforms to J-STD-004, REL0.

Main Features

• Excellent wettability
• Hard non-conductive residues

Cleaning

NC600 is a no clean formulation. Therefore the residues do not need to be removed for typical applications.

Typical Analysis

Melting Point, degrees C 217-221

Hardness, Brinell 15HB

Coefficient of Thermal Expansion Pure Sn=23.5

Tensile Strength, psi 4312

Density, g/cc 7.39

Electrical Resistivity, (uohm-cm) 13.0

Electrical Conductivity, %IACS 16.6

Yield Strength, psi 3724

Total Elongation, % 27

Joint Shear Strength, at 0.1mm/min 20 C  27

Joint Shear Strength, at 0.1mm/min 100 C  17

Creep Strength, N/mm² at 0.1mm/min 20 C  13.0

Creep Strength, N/mm² at 0.1mm/min 100 C  5

Thermal Conductivity, W/m.K 58.7